ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,440,018, issued on Oct. 14.
"Modular attachment load system" was invented by Tomasz B. Mironski (Cameron, N.C.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A modular attachment load system includes a substrate having multiple spaced apart holes; a binding material; and an article having spaced apart holes aligned with a portion of the substrate's holes. A method of using the system includes securing an end of the binding material to the substrate; positioning the article against the substrate; threading the binding material through one of the articles' holes; threading the binding material alternately through the substrate's holes and the article's ho...