US Patent Issued on Nov. 4 for "Mold device for resin molded article, molding apparatus, molding system, and method for manufacturing molded article" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,173, issued on Nov. 4.

"Mold device for resin molded article, molding apparatus, molding system, and method for manufacturing molded article" was invented by Yasuhiro Suzuki (Suzuka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a foam-molded article by performing a GCP, the method including a step of retreating a mobile side of a mold clamping mechanism of a sealed mold at the same time as when a step of discharging a gas is started, during the step of discharging the gas, immediately after the step of discharging the gas or when a specified delay time after the step of discharging the gas is finished for performing...