US Patent Issued on Nov. 25 for "Semiconductor package including bonding wire coated with oxide insulation, electronic system including same, and battery module including same" (South Korean Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,783, issued on Nov. 25.

"Semiconductor package including bonding wire coated with oxide insulation, electronic system including same, and battery module including same" was invented by Soo Jae Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a bonding wire coated with oxide insulation, an electronic system including same, and a battery module including same. The semiconductor package includes: a substrate; a semiconductor chip mounted on the substrate; a bonding wire connecting the substrate and the semiconductor chip and including a metal core portion located on the inside and an ...