ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,707, issued on Nov. 25.
"Method of manufacturing semiconductor device and collet" was invented by Tsuyoshi Tazawa (Tokyo), Kei Itagaki (Tokyo), Yoshinobu Ozaki (Tokyo) and Ayako Taira (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A collet for compressing an adhesive-attached chip, the collet including a main body having a first pressing surface to which a pressing force from a compressing device is directly transmitted, and a projecting portion projecting from the main body and having a second pressing surface provided along an outer circumference of the first pressing surface, the first pressing surface and the second pressing surface formi...