US Patent Issued on Nov. 25 for "Method for manufacturing semiconductor device and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,670, issued on Nov. 25.

"Method for manufacturing semiconductor device and semiconductor device" was invented by Keiichi Hatakeyama (Tokyo), Masaaki Takekoshi (Tokyo) and Goki Toshima (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "As an example, a method for mounting a bridge die 20 on a support such as a redistribution layer in a state where a connection terminal of the bridge die 20 faces upward (face-up) is disclosed. In this method, before forming an adhesive layer on a back surface of the bridge die, a resin layer 23 is formed so as to cover terminal electrodes 22 on a semiconductor substrate 21 of the bridge die 20 with a thermosetting ...