ALEXANDRIA, Va., June 10 -- United States Patent no. 12,295,124, issued on May 6.
"Dual liquid pump liquid cooling radiator and liquid cooling heat dissipation device" was invented by Tsung-Hsien Huang (I-Lan Hsien, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention discloses a dual liquid pump liquid cooling radiator and a liquid cooling heat dissipation device. The dual liquid pump liquid cooling radiator includes two liquid boxes and a plurality of radiator pipe sets arranged side by side between the two liquid boxes. The interior of one liquid box is divided into a hot liquid chamber and a cold liquid chamber by an air heat insulation space, and a first liquid pump is installed therein. ...