US Patent Issued on May 6 for "Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure" (Taiwanese Inventor)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,966, issued on May 6.

"Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure" was invented by Chun-Ming Lin (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method for forming a multilayer wiring structure, which includes: forming a patterned copper-phosphorous alloy layer over a carrier by performing a plating operation, and forming a dielectric layer over the patterned copper-phosphorous alloy layer. The forming the patterned copper-phosphorous alloy layer includes providing a plating solution having a copper source and a phosphorous source...