ALEXANDRIA, Va., June 17 -- United States Patent no. D1,077,159, issued on May 27.
"Heat pump" was invented by Weitao Chen (Foshan, China), Peiming Chen (Foshan, China) and Tianyou Li (Yangjiang, China).
The patent was filed on Oct. 28, 2022, under Application No. D/858,200.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1077159&OS=D1077159&RS=D1077159
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