ALEXANDRIA, Va., June 17 -- United States Patent no. D1,076,873, issued on May 27.
"Bone conduction headphone" was invented by Feng Deng (Jiangsu, China), Haijuan Li (Jiangsu, China) and Hongbin Cao (Jiangsu, China).
The patent was filed on April 1, 2024, under Application No. D/520,979.
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