ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,644, issued on May 20.
"Cooling pump assembly" was invented by Cheng-Jiang Hou (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling pump assembly has a cooling pump, a mount, a shaft, and a driving set. Wherein, a driving unit of the driving set is configured to connect a device to be cooled and has a central hole fluidly communicating with an interior of the cooling pump. The shaft is inserted in the cooling pump, the mount, and the driving unit. The shaft is connected to the driving unit and the cooling pump. The shaft has a channel fluidly communicating with the device to be cooled and fluidly communicating with the channel...