US Patent Issued on May 13 for "Device packages including redistribution layers with carbon-based conductive elements, and methods of fabrication" (Idaho Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,622, issued on May 13.

"Device packages including redistribution layers with carbon-based conductive elements, and methods of fabrication" was invented by Eiichi Nakano (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor device packages include a redistribution layer (RDL) with carbon-based conductive elements. The carbon-based material of the RDL may have low electrical resistivity and may be thin (e.g., less than about 0.2 micro metre). Adjacent passivation material may also be thin (e.g., less than about 0.2 micro metre). Methods for forming the semiconductor device packages include forming the carbon-based material (e.g., ...