ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,497, issued on May 13.
"Densely packed electronic systems" was invented by Peter C. Salmon (Mountain View, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A high-resolution substrate having an area of at least 100 square centimeters and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components, thereby creating a circuit assembly. Each independently operable cluster of components preferably includes a power distribution chip, a test/monitor chip, and at least one redundant chip for each type of logic device and for each type of memory...