ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,377, issued on May 13.
"Conductive adhesive composition, and method for producing connection structure" was invented by Shinichirou Sukata (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A conductive adhesive composition, the composition containing: (A) conductive particles; (B) a thermosetting resin; and (C) a flux activator. The conductive particles contain a metal having a melting point of 200deg C. or lower. In a volume-based cumulative particle size distribution of the conductive particles, a cumulative 50% particle diameter D50 is 3 to 10 micro metre, and a cumulative 10% particle diameter D10 is 2.4 micro metre or more. The flux activat...