US Patent Issued on March 25 for "Methods for forming engineered thermal paths of printed circuit boards by use of removable layers" (California Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,464, issued on March 25.

"Methods for forming engineered thermal paths of printed circuit boards by use of removable layers" was invented by Matthew D. Neely (Santa Ana, Calif.), Michael Len (Santa Ana, Calif.) and King Yip Leung (Santa Ana, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a thermal and electrical path in a PCB may include forming a first removable layer over a top surface of a PCB and a second removable layer over a bottom surface of the PCB. The method may also include milling or laser drilling the PCB from the top surface to form a first cavity extending into the PCB, plating the first side panel platin...