ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,493, issued on March 18.
"Rapid implementation of high-temperature analog interface electronics" was invented by Ian Getreu (Tigard, Ore.), James A. Holmes (Fayetteville, Ark.), Brandon Dyer (Prairie Grove, Ark.), Jacob Kupernik (Bella Vista, Ark.), Matthew Barlow (Springdale, Ark.), Nicholas Chiolino (Springdale, Ark.) and Anthony Matt Francis (Elkins, Ark.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-layer ceramic wiring board is patterned with arrays of footprints for high-temperature surface mounted device active and passive components on one side of the board that is patterned with arrays of standard SMD footprints to enable placemen...