ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,474, issued on June 24.
"Customized thermal pathways in a PCB" was invented by Todd Robinson (San Mateo, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments and fabrication methods for a printed circuit board are provided. The embodiments include milling a first cavity in a first sub-lam, wherein the first cavity extends partially through the first sub-lam and milling a second cavity in a prepreg layer. The first sub-lam, the prepreg layer, and a material sheet are stacked and laminated to form a composite cavity from the first cavity and the second cavity. The embodiments also include removing from the laminated stack one or more port...