US Patent Issued on June 17 for "Multi-height interconnect trenches for resistance and capacitance optimization" (Oregon Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,392, issued on June 17.

"Multi-height interconnect trenches for resistance and capacitance optimization" was invented by Kevin Lai Lin (Beaverton, Ore.), Mauro Kobrinsky (Portland, Ore.), Mark Anders (Hillsboro, Ore.), Himanshu Kaul (Portland, Ore.) and Ram Krishnamurthy (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include interconnect layers that include non-uniform interconnect heights and methods of forming such devices. In an embodiment, an interconnect layer comprises an interlayer dielectric (ILD), a first interconnect disposed in the ILD, wherein the first interconnect has a first height, and a s...