US Patent Issued on June 17 for "Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI)" (Arizona Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,447, issued on June 17.

"Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI)" was invented by Kristof Darmawikarta (Chandler, Ariz.), Tarek Ibrahim (Mesa, Ariz.), Siddharth Alur (Chandler, Ariz.), Rahul Jain (Gilbert, Ariz.) and Haobo Chen (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein relate to lithographically defined vertical interconnect accesses (litho-vias) for a bridge die first level interconnect (FLI) and techniques of fabricating such litho-vias. In one example, a package substrate comprises a bridge die embedded in the package substrate; a...