US Patent Issued on July 8 for "Memory devices with backside bond pads under a memory array" (American, Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,982, issued on July 8.

"Memory devices with backside bond pads under a memory array" was invented by Eric N. Lee (San Jose, Calif.) and Akira Goda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is provided, comprising a substrate with a frontside and a backside opposite the frontside; control circuitry disposed over the frontside of the substrate; a memory array disposed over and electrically coupled to the control circuitry; a through-silicon via (TSV) disposed under the memory array, the TSV extending through the substrate from the control circuitry to the backside of the substrate; and a bond pad disposed on the backside of the...