US Patent Issued on July 8 for "Attachment method for microfluidic device" (California Inventor)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,350,662, issued on July 8.

"Attachment method for microfluidic device" was invented by Peter C. Lord (Alpine, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In embodiments, a silicon part and a titanium part may be soldered together without breakage or instability. In embodiments, silicon and titanium may be soldered together with a soft solder joint including indium silver, where the temperature excursion between solder solidus and use temperature limits the strain between the two surfaces. In embodiments a silicon micropump surface may be treated to remove its silicon oxide coating, and then Ti-W, Nickel, and gold layers successively sputtered o...