US Patent Issued on July 29 for "Layered plate and wiring base board production method" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,235, issued on July 29.

"Layered plate and wiring base board production method" was invented by Masaya Toba (Tokyo), Kazuyuki Mitsukura (Tokyo) and Masaki Yamaguchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A layered plate including a copper layer having a thickness of 5 micro metre or less, and a resin layer provided on a surface of the copper layer, in which a water absorption rate of the resin layer is 1% or less after being left in an environment of 130deg C. in temperature and 85% in relative humidity for 200 hours."

The patent was filed on Dec. 25, 2020, under Application No. 18/258,556.

*For further information, including images...