US Patent Issued on July 22 for "Microelectronic devices with through-substrate interconnects and associated methods of manufacturing" (Idaho Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,096, issued on July 22.

"Microelectronic devices with through-substrate interconnects and associated methods of manufacturing" was invented by Kyle K. Kirby (Eagle, Idaho), Kunal R. Parekh (Boise, Idaho) and Sarah A. Niroumand (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic devices with through-substrate interconnects and associated methods of manufacturing are disclosed herein. In one embodiment, a semiconductor device includes a semiconductor substrate carrying first and second metallization layers. The second metallization layer is spaced apart from the semiconductor substrate with the first metallization layer thereb...