US Patent Issued on July 1 for "Wafer positioning and correction method, system, and device" (Chinese, American Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,714, issued on July 1.

"Wafer positioning and correction method, system, and device" was invented by Rongsheng Lyu (Nanjing, China), Han Zhang (Nanjing, China), Zhichun Guo (Nanjing, China) and Zuojun Shen (Moraga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor wafer transfer device has a wafer positioning deskewing method via steps of initially setting parameters for the size of a wafer to be measured; collecting a motor rotational angle initialization settings for the size of the wafer to be measured; collecting motor angle data Alphai and optical calibrator optical calibrator shading length data si; calculating the wafer tur...