US Patent Issued on July 1 for "Semiconductor light source device of optical integrated packaging" (Chinese, American Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,524, issued on July 1.

"Semiconductor light source device of optical integrated packaging" was invented by Wei Huang (Shenzhen, China), Yuxing Cao (Shenzhen, China) and Yang Wang (Dublin, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application relates to the technical field of optical integrated devices, and specifically discloses a semiconductor light source device of optical integrated packaging with high light extraction efficiency and low device heat generation. The semiconductor light source device of optical integrated packaging comprises a substrate, an optical lens, a LED chip and a light transmitting glue layer, the sub...