ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,135, issued on Jan. 20.
"Wire guide module, and ultrasonic wire bonder therewith" was invented by Andreas Unger (Verl, Germany), Frank Walther (Paderborn, Germany), Michael Broekelmann (Delbrueck, Germany) and Matthias Hunstig (Paderborn, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wire guide module for an ultrasonic wire bonder, comprising a body made of a thermally stable metallic and/or ceramic material, wherein an elongated wire feed-through channel having a wire inlet opening and having a wire outlet opening is provided on the body, and comprising a guide tube provided in the wire feed-through channel. In addition, the invention re...