US Patent Issued on Jan. 20 for "Correction device for wafers and rotational drive mechanism of the wafers and correction method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,701, issued on Jan. 20.

"Correction device for wafers and rotational drive mechanism of the wafers and correction method thereof" was invented by Mao-Yen Sung (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A correction device for wafers and rotational drive mechanism of the wafers and a correction method thereof. The correction device includes a first robotic arm, an image capturing assembly and a wafer locating member installation/uninstallation mechanism disposed on the first robotic arm. The correction device further includes a second robotic arm and a wafer taking/placing mechanism disposed on the second robotic arm. The first ro...