US Patent Issued on Feb. 3 for "Temporary fixation layered film and production method therefor, temporary fixation layered body, and semiconductor device production method" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,538, issued on Feb. 3.

"Temporary fixation layered film and production method therefor, temporary fixation layered body, and semiconductor device production method" was invented by Yuta Akasu (Tokyo), Emi Miyazawa (Tokyo), Takashi Kawamori (Tokyo), Yasuyuki Oyama (Tokyo) and Tetsuya Enomoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing a laminated film for temporary fixation of a semiconductor member to a support member includes providing a first curable resin layer on one surface of a metal foil and providing a second curable resin layer on the other surface of the metal foil to obtain the laminated film. A laminated f...