US Patent Issued on Feb. 3 for "Microelectronic device assemblies, stacked semiconductor die assemblies, and memory device packages" (Idaho Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,610, issued on Feb. 3.

"Microelectronic device assemblies, stacked semiconductor die assemblies, and memory device packages" was invented by Randon K. Richards (Kuna, Idaho), Aparna U. Limaye (Boise, Idaho), Owen R. Fay (Meridian, Idaho) and Dong Soon Lim (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the...