ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,758, issued on Feb. 10.
"Substrate and manufacturing method thereof" was invented by Dyi-Chung Hu (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate includes a first TGV unit and a second TGV unit. The second TGV unit is bonded to the first TGV unit. The first TGV unit is electrically connected to the second TGV unit, and a directly bonding interface including a glass-to-glass bonding interface and a metal-to-metal bonding interface is located between the first TGV unit and the second TGV unit. A manufacturing method of a substrate is also provided."
The patent was filed on Dec. 29, 2024, under Application No. 19/004...