ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,712, issued on Feb. 10.
"Bulk substrate backside power rail" was invented by Ruilong Xie (Niskayuna, N.Y.), Kisik Choi (Watervliet, N.Y.), Junli Wang (Slingerlands, N.Y.) and Tenko Yamashita (Schenectady, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a front-end-of-line level including a plurality of field effect transistors electrically connected to a back-end-of-line interconnect level located on a first side of the front-end-of-line level. A plurality of shallow trench isolation regions are located between adjacent field effect transistors, each of the plurality of shallow trench isolation regions being su...