ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,962, issued on Feb. 10.
"Aluminum profile injection bonding method" was invented by Byungchan Kim (Busan, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An aluminum profile injection bonding method including a product preparation operation of manufacturing a plurality of aluminum profiles to be bonded in accordance with a product design, a mold preparation operation of manufacturing a mold designed in accordance with the aluminum profiles prepared through the product preparation operation, a seating operation of seating the plurality of aluminum profiles to be bonded in the mold in a state of being in contact with each other, and an inje...