ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,492,024, issued on Dec. 9.
"System and method for a substrate filling machine" was invented by Wei K Hsu (Parker, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A filling machine and method for filling bags with substrate. Bags are received in a receptacle of a filling machine. Substrate is received in a hopper of the filling machine. An activation signal is received through a user interface of the filling machine. A first pneumatic arm is moved to abut an opening for a first side of a bag that is one of the bags. Suction is applied to the bag utilizing one or more nozzles integrated with the first pneumatic arm. The bag is moved to a fill location...