ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,615, issued on Dec. 30.
"Substrate-conveying support tape and electronic apparatus/device production method" was invented by Shinji Irizawa (Tokyo), Shogo Sobue (Tokyo), Mika Tanaka (Tokyo) and Saeko Ogawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent hav...