US Patent Issued on Dec. 30 for "Scan-less 3D optical sensing devices and associated lidar based on stacking of integrated photonic chips, wavelength division demultiplexing and position-to-angle conversion of a lens" (Nevada Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,637, issued on Dec. 30.

"Scan-less 3D optical sensing devices and associated lidar based on stacking of integrated photonic chips, wavelength division demultiplexing and position-to-angle conversion of a lens" was invented by Xiaotian Steve Yao (Las Vegas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is devices and techniques for 3D LiDAR sensing without beam scanning with moving parts or 2D optical imaging based on the combination of a lens' position-to-angle conversion and the wavelength division multiplexing/demultiplexing (WDM) in the output probe light for LiDAR sensing. This 3D LiDAR sensing can be implemented on stacked photonic in...