US Patent Issued on Dec. 30 for "Resin composition for provisional fixation, support tape for substrate conveyance and method for producing electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,613, issued on Dec. 30.

"Resin composition for provisional fixation, support tape for substrate conveyance and method for producing electronic device" was invented by Mika Tanaka (Tokyo), Shogo Sobue (Tokyo), Shinji Irizawa (Tokyo) and Saeko Ogawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130deg C. and for 2 hours at 170deg C., the film obtains an ...