US Patent Issued on Dec. 30 for "Method for manufacturing a memory structure having stacked data lines and conductive structures on sides thereof" (Idaho Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,903, issued on Dec. 30.

"Method for manufacturing a memory structure having stacked data lines and conductive structures on sides thereof" was invented by Darwin A. Clampitt (Wilder, Idaho), Roger W. Lindsay (Boise, Idaho), Christopher R. Ritchie (Boise, Idaho), Shawn D. Lyonsmith (Boise, Idaho), Matthew J. King (Boise, Idaho) and Lisa M. Clampitt (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatus includes a first conductive contact; a second conductive contact; levels of conductive materials stacked over one another and located over the first...