US Patent Issued on Dec. 2 for "Module with high peak bandwidth I/O channels" (Texas Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,530, issued on Dec. 2.

"Module with high peak bandwidth I/O channels" was invented by L Pierre de Rochemont (Horseshoe Bay, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high peak bandwidth I/O channel embedded within a multilayer surface interface that forms the bus circuitry electrically interfacing the output or input port on a first semiconductor die with the input or output port on a second semiconductor die."

The patent was filed on Feb. 1, 2024, under Application No. 18/429,960.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fneta...