US Patent Issued on Aug. 5 for "Microelectronic devices with lower recessed conductive structures and related methods" (Idaho Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,637, issued on Aug. 5.

"Microelectronic devices with lower recessed conductive structures and related methods" was invented by Anilkumar Chandolu (Boise, Idaho) and Indra V. Chary (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic devices include a stack structure with a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. Conductive contact structures extend through the stack structure. An insulative material is between the conductive contact structures and the tiers of the stack structure. In a lower tier portion of the stack structure, a conductive structure, of the conduct...