US Patent Issued on Aug. 26 for "Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,398,298, issued on Aug. 26.

"Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor device" was invented by Takahiro Kuroda (Tokyo), Tomohiro Nagoya (Tokyo) and Naoki Tomori (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A temporary protective film for temporarily protecting a surface of a semiconductor substrate that is opposite to a surface on which a semiconductor element is mounted. The temporary protective film includes an adhesive layer containing acrylic rubber. When the temporary protective film is attached to a copper alloy plate at 25deg C. so that the adhesive layer is in contact...