US Patent Issued on Aug. 26 for "Reflow soldering machine for continuously soldering of soldering goods" (German Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,256, issued on Aug. 26.

"Reflow soldering machine for continuously soldering of soldering goods" was invented by Thomas Huhler (Neubrunn, Germany), Benedict Fleischmann (Neubrunn, Germany) and Ruppert Elmar (Mespelbrunn, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention concerns a reflow soldering machine for continuously soldering of soldering goods in a process channel along a process direction, whereby the process channel comprises at least one pre-heating zone, at least one soldering zone, and at least one cooling zone, whereby the soldering zone comprises a pressure chamber comprising one base part and one cover part opposite...