ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,397,172, issued on Aug. 26.
"Chip pad decompression structure" was invented by Li-Chi Lin (Changhua County, Taiwan) and Yi-Ying Lin (Changhua County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip pad decompression structure includes a pad, a protective ring, a chip, and an upper lid. A middle of one side of the pad has a raised portion. Another side of the pad has a recess. The protective ring is disposed in the recess of the pad. The protective ring has a through hole. The chip is disposed in the through hole of the protective ring and located in the recess of the pad. The upper lid is configured to cover the protective ring and the chip...