US Patent Issued on Aug. 19 for "Wafer carrier disc installation/uninstallation device and installation/uninstallation method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,653, issued on Aug. 19.

"Wafer carrier disc installation/uninstallation device and installation/uninstallation method thereof" was invented by Mao-Yen Sung (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer carrier disc installation/uninstallation device and an installation/uninstallation method thereof. The installation/uninstallation device includes a first robotic arm 1, a second robotic arm 2, a carrier disc 3, a main correction mechanism 4, a wafer correction mechanism 5 and a material rest mechanism 6. The carrier disc 3, the main correction mechanism 4, the wafer correction mechanism 5 and the material rest mechanism 6 are...