ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,970, issued on Aug. 12.
"Test socket and apparatus for testing a semiconductor package" was invented by Wonjung Kim (Incheon, South Korea), Zunbae Moon (Gyeonggi-do, South Korea) and Kyouyong Han (Incheon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A test socket and a test apparatus for testing a semiconductor package are provided. The test socket includes: a first connection structure including a first insulating body and a plurality of conductive plugs within the first insulating body; and a second connection structure disposed on the first connection structure and including a second insulating body and a plurality of elastic condu...