US Patent Issued on April 22 for "Adhesive for semiconductor, production method therefor, and semiconductor device and production method therefor" (Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,565, issued on April 22.

"Adhesive for semiconductor, production method therefor, and semiconductor device and production method therefor" was invented by Toshiyasu Akiyoshi (Tokyo), Masanobu Miyahara (Tokyo) and Ryuta Kawamata (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive for semiconductors, the adhesive containing a thermoplastic resin, a thermosetting resin, a curing agent having a reactive group, and a flux compound having an acid group. The adhesive has a calorific value of 20 J/g or less at 60deg C. to 155deg C. on a DSC curve, which is obtained by differential scanning calorimetry involving heating the adhesive at a rate of...