INTERNATIONAL PATENT: ZTE CORPORATION, 中兴通讯股份有限公司 FILES APPLICATION FOR "DIFFERENTIAL VIA HOLE STRUCTURE, BALL GRID ARRAY ASSEMBLY, PRINTED CIRCUIT BOARD AND COMMUNICATION DEVICE"

GENEVA, Nov. 9 -- ZTE CORPORATION (ZTE Plaza, Keji Road SouthHi-tech Industrial Park, Nanshan DistrictShenzhen, Guangdong 518057), 中兴通讯股份有限公司 (中国广东省深圳市南山区高新技术产业园科技南路中兴通讯大厦) filed a patent application (PCT/CN2025/083454) for "DIFFERENTIAL VIA HOLE STRUCTURE, BALL GRID ARRAY ASSEMBLY, PRINTED CIRCUIT BOARD, AND COMMUNICATION DEVICE" on Mar 19, 2025. With publication no. WO/2025/227983, the details related to the patent application was published on Nov 06, 2025.

Notably, the patent...