GENEVA, Nov. 25 -- YUYAMA MFG. CO., LTD. (4-30, Meishinguchi 1-chome, Toyonaka-shi, Osaka5610841), 株式会社湯山製作所 (大阪府豊中市名神口一丁目４番３０号) filed a patent application (PCT/JP2025/017855) for "POWDER WRAPPING SUPPORT SYSTEM" on May 16, 2025. With publication no. WO/2025/239450, the details related to the patent application was published on Nov 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MITANI, Mitsuhiro (c/o YUYAMA ...