GENEVA, March 24 -- YKK CORPORATION (1,Kanda Izumi-cho,Chiyoda-ku, Tokyo1018642), YKK株式会社 (東京都千代田区神田和泉町1番地) filed a patent application (PCT/JP2023/033443) for "ELECTROPLATING DEVICE AND METHOD THEREFOR, PRODUCTION METHOD FOR PLATED ARTICLE, AND PLATING TANK" on Sep 13, 2023. With publication no. WO/2025/057345, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HAIZUKA,Yuhe...