INTERNATIONAL PATENT: YIELD ENGINEERING SYSTEMS, INC. FILES APPLICATION FOR "IMPROVED ADHESION STRENGTH OF METAL-ORGANIC INTERFACES IN ELECTRONIC DEVICES"

GENEVA, Feb. 18 -- YIELD ENGINEERING SYSTEMS, INC. (3178 Laurelview Ct.Fremont, California 94538) filed a patent application (PCT/US2024/039167) for "IMPROVED ADHESION STRENGTH OF METAL-ORGANIC INTERFACES IN ELECTRONIC DEVICES" on Jul 23, 2024. With publication no. WO/2025/034400, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SAUTTER, Kenneth (3178 Laurelview Ct.Fremont, California 94538)

Abstract: A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate w...