GENEVA, Feb. 2 -- YANGTZE MEMORY TECHNOLOGIES CO., LTD. (No. 88 Weilai 3rd RoadEast Lake High-tech Development ZoneWuhan, Hubei 430000) filed a patent application (PCT/CN2023/108623) for "ENHANCED INTERCONNECTION BALL GRID ARRAY DESIGN, SEMICONDUCTOR STRUCTURE, AND FABRICATING METHOD THEREOF" on Jul 21, 2023. With publication no. WO/2025/019981, the details related to the patent application was published on Jan 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ZHAO, Shanshan (No. 88 Weilai 3rd RoadEast Lake High-tech Development ZoneWuhan, Hubei 430000), ZHANG, Baohua (No. 88 Weilai 3rd Ro...