INTERNATIONAL PATENT: YANGTZE MEMORY TECHNOLOGIES CO., LTD., 长江存储科技有限责任公司 FILES APPLICATION FOR "CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR AND STORAGE SYSTEM AND ELECTRONIC DEVICE"

GENEVA, Feb. 2 -- YANGTZE MEMORY TECHNOLOGIES CO., LTD. (No.88 Weilai 3rd Road, East Lake High-tech Development ZoneWuhan, Hubei 430000), 长江存储科技有限责任公司 (中国湖北省武汉市东湖新技术开发区未来三路88号) filed a patent application (PCT/CN2023/109175) for "CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR, AND STORAGE SYSTEM AND ELECTRONIC DEVICE" on Jul 25, 2023. With publication no. WO/2025/020091, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the In...